RoHS Compliance
Global sensitivities towards the environment continue to increase and the use of harmful compounds and substances in commercial & industrial devices is a growing concern. Directive (EU) 2015/863 which amends Directive 2011/65/EU Annex II restricts 10 hazardous substances in electrical and electronic equipment (EEE) and requires manufacturers to prepare EU declaration of conformity and affix CE markings on finished products. The substances and limits are:
- Cadmium(Cd): 0.01%
- Mercury: 0.1%
- Lead(Pb): 0.1%
- Hexavalent chromium (Cr6+): 0.1%
- Polybrominated biphenyls (PBB): 0.1 %
- Polybrominated diphenyl ethers (PBDE): 0.1 %
- Bis(2-Ethylhexyl) phthalate (DEHP): 0.1%
- Benzyl butyl phthalate (BBP): 0.1%
- Dibutyl phthalate (DBP): 0.1%
- Diisobutyl phthalate (DIBP): 0.1%
QuickLogic is strongly committed to the movement to minimize or eliminate the use of hazardous materials in our products. This is in alignment with our corporate Environment, Health and Safety direction and we work closely with our supply chain to meet these goals. All Quicklogic Lead(Pb) Free devices are 100% RoHS 2 compliant.
Lead Free Implementation
A major impact on semiconductor components is the ability to handle the higher reflow temperatures required for board mounting of Lead(Pb) Free solder systems. This is due to the different material sets used to assemble packages in order to meet Lead(Pb) Free requirements. QuickLogic has chosen the Sn/Ag/Cu alloy as the solder ball alloy for laminate/ball grid array products, and Sn(matte) as the lead finish for lead-frame based products.
Lead Free Device Availability
The table below shows the QuickLogic devices available in Lead(Pb) Free packaging.
| Device family | Packages available |
| EOS | 64BGA, 64QFN, 42WLCSP |
| ArcticLink 3 S1 | 64BGA, 30WLCSP |
| ArcticLink 3 S2 | 64GBA, 30 WLCSP |
| PolarPro 3 | 64BGA, 30WLCSP |
| ArcticLink III VX & BX | 120WLCSP |
| ArcticLink II VX | 121TFBGA |
| ArcticLink | 121TFBGA *5, 196TFBGA (12x12mm) |
| PolarPro I & II | 144TQFP, 256LBGA, 324LBGA, 86TFBGA *3, 121TFBGA *3, 132TFBGA *3, 196TFBGA *4 |
| Eclipse II | 100VQFP, 101TFBGA *3 , 144TQFP, 196TFBGA (both 12x12mm and 8x8mm packages), 208PQFP, 280LFBGA, 484PBGA |
| QuickPCI | 144TQFP, 196TFBGA, 208PQFP *1 , 256PBGA, 280LFBGA *1 , 456PBGA, 484PBGA *1 |
| QuickRAM | 100TQFP, 144TQFP, 208PQFP, 256PBGA, 456PBGA |
| pASIC 3 | 100TQFP *2 , 144TQFP, 208PQFP, 256PBGA, 456PBGA |
*1: Lead(Pb) Free package not available for QL5732, and QL5632
*2: Lead(Pb) Free package not available for QL3004E
*3: 0.5mm pitch package
*4: Available in 0.8mm and 0.5mm pitches
*5: 0.65mm pitch package
Ordering Information
QuickLogic Lead(Pb) Free products are denoted by an “N” between the package letters and the number of leads/balls. For example QL8325-6PQ208C will become QL8325-6PQN208C for the Lead(Pb) Free option.
