Unveiled SensiML Data Studio – Next-Generation Sensor Data Management for AI/ML
Secured New eFPGA IP Contract on UMC’s 22nm Process
Announced New Aurora™ FPGA/eFPGA User Tools with Enhancements for Reconfigurable Computing
Announced New eFPGA Contract Targeting GlobalFoundries™ 22FDX® Platform
Partnered with Xiphera to Pioneer Post-Quantum Cryptography on eFPGAs
Introduced SensiML Support for Espressif’s ESP32 Wireless SoC and IDF Compiler
Unveiled Customizable eFPGA IP on GlobalFoundries’ 12LP Process
Partnered with YorChip to Develop Low-Power, Low-Cost UCIe FPGA Chiplets
Drove eFPGA Innovation with New Aurora™ Development Tool Suite
2022
aiSensing deployed a highly successful end-point AI vibration sensor using the SensiML Analytics Toolkit and QuickLogic’s EOS S3
Announced a disaggregated, flexible eFPGA chiplet template with eTopus
Partnered with Intrinsic ID to provide eFPGA security solutions
SensiML delivered new AI accelerator core support for Silicon Labs MG24 and BG24 Series 2 Bluetooth® Wireless SoCs.
Added GlobalFoundries 22FDX Process to its growing list of Australis IP Generator-Based eFPGA IP
SensiML added AI capabilities to Arduino Nicla Sense ME featuring Bosch Sensortec sensors
Delivered eFPGA IP for TSMC 22nm process from Australis IP Generator
Announced the first Rad-Hard eFPGA IP for SkyWater RH90 process
SensiML teamed with Infineon to provide a complete AI/ML solution for PSoC™ 6 MCUs and a wide range of sensors
2021
Launched SensiML open source initiative to assert leadership for commercial AI adoption of smart sensing IoT applications
Announced an Amazon-qualified reference design for hearables or battery-powered applications to communicate directly with Alexa
Joined DARPA Toolbox Initiative to provide Mil/Aero/Defense Grade Programmable Logic
Joined the newly formed Open Source FPGA Foundation as founding and premier member
2020
Launched QuickLogic Open Reconfigurable Computing (QORC) Initiative with 100% open source hardware and software support for EOS S3 MCU+eFPGA becoming 1st Programmable Logic company to embrace open source tools
Introduced Qomu, an open source hardware dev kit that fits in a USB Type-A slot, enabling portability and development anywhere
Announced the availability of eFPGA technology on 28nm FD-SOI process and also became a member of the Samsung SAFE™ IP Partner Program
2019
Announced the strategic partnership with SiFive & the launch of SoC templates
Launched EOS S3AI SoC Platform for Time Series IoT Endpoint Applications
Acquired SensiML SaaS AI Company
2018
Announced the availability of eFPGA on TSMC 40nm Process
ArcticPro 2 eFPGA IP available for the GLOBALFOUNDRIES 22FDX® (FD-SOI) process
Introduced comprehensive QuickAI Platform for Edge & Endpoint AI Applications
2017
Established eFPGA Support Center in Taiwan to Accelerate IP Licensing Model
2016
Introduced ArcticPro eFPGA on GLOBALFOUNDRIES 65nm and 40nm process
Joined GLOBALFOUNDRIES FDXcelerator(TM) Partner Program
ArcticLink 3 S2 ultra-low power sensor hub released, offering mobile OEMs significantly increased processing and storage abilities with low power consumption
2013
ArcticLink 3 S1 ultra-low power sensor hub announced, offering mobile OEMs always-on context awareness
PolarPro 3 announced, QuickLogic’s first reprogrammable logic device for mobile and industrial markets
2012
ArcticLink III BX display interface bridge announced, offering OEMs a low-cost, flexible solution for bridging displays with mobile processors
2011
ArcticLink III VX announced, combining display bridging with visual enhancement and power savings technologies
VEE HD+ and HD+ announced, extending the high-quality display experience and battery life savings for smartphones and tablets with up to FullHD 1,920 × 1,200 displays
2010
ArcticLink II VX display bridge announced, introducing Visual Enhancement Engine and providing a high-quality display experience with 25% average battery life extension for smartphones
2008
Announced PolarPro II FPGA, designed to meet the connectivity, intelligence, security and system logic requirements for mobile applications
2007
CSSP Solutions customer engagement model announced; innovative hardware + software solution for mobile and industrial customers
2001
Introduction of first SoC (MCU + eFPGA)
1999
October 15 – Initial Public Offering on Nasdaq
1997
Introduction of first standard product with eFPGA
1994
Open Tool Synthesis introduced
1991
Introduction of market’s highest performance, lowest power FPGAs
1988
Founded by three of the early inventors of the programmable logic industry, John Birkner, Andy Chan, HT Chua
Introduction of ViaLink technology
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