2024
- Secured $5.26M contract for Strategic Radiation Hardened FPGA Technology
- Signed seven-figure eFPGA IP deal for GlobalFoundries' 12LP process
- Delivered TSMC N12e eFPGA IP to a major customer in three months
- Earned BAE Systems 'Partner 2 Win' Technology Innovation Supplier of the Year award
2023
- Secured New eFPGA IP Contract on UMC's 22nm Process
- Announced New eFPGA Contract Targeting GlobalFoundries™ 22FDX® Platform
- Partnered with Xiphera to Pioneer Post-Quantum Cryptography on eFPGAs
- Unveiled Customizable eFPGA IP on GlobalFoundries' 12LP Process
- Partnered with YorChip to Develop Low-Power, Low-Cost UCIe FPGA Chiplets
2022
- Delivered eFPGA IP for TSMC 22nm process with Australis IP Generator
- Announced first Rad-Hard eFPGA IP for SkyWater RH90 process
- Added GlobalFoundries 22FDX process to Australis IP-based eFPGA portfolio
2021
- Launched SensiML open source initiative to assert leadership for commercial AI adoption of smart sensing IoT applications
- Announced an Amazon-qualified reference design for hearables or battery-powered applications to communicate directly with Alexa
- Joined DARPA Toolbox Initiative to provide Mil/Aero/Defense Grade Programmable Logic
- Joined the newly formed Open Source FPGA Foundation as founding and premier member
2020
- Launched QuickLogic Open Reconfigurable Computing (QORC) Initiative with 100% open source hardware and software support for EOS S3 MCU+eFPGA becoming 1st Programmable Logic company to embrace open source tools
- Introduced Qomu, an open source hardware dev kit that fits in a USB Type-A slot, enabling portability and development anywhere
- Announced the availability of eFPGA technology on 28nm FD-SOI process and also became a member of the Samsung SAFE™ IP Partner Program
2019
- Announced the strategic partnership with SiFive & the launch of SoC templates
- Launched EOS S3AI SoC Platform for Time Series IoT Endpoint Applications
- Acquired SensiML SaaS AI Company
2018
- Announced the availability of eFPGA on TSMC 40nm Process
- ArcticPro 2 eFPGA IP available for the GLOBALFOUNDRIES 22FDX® (FD-SOI) process
- Introduced comprehensive QuickAI Platform for Edge & Endpoint AI Applications
2017
- Established eFPGA Support Center in Taiwan to Accelerate IP Licensing Model
2016
- Introduced ArcticPro eFPGA on GLOBALFOUNDRIES 65nm and 40nm process
- Joined GLOBALFOUNDRIES FDXcelerator(TM) Partner Program
2014
- ArcticLink 3 S2 ultra-low power sensor hub released, offering mobile OEMs significantly increased processing and storage abilities with low power consumption
2013
- ArcticLink 3 S1 ultra-low power sensor hub announced, offering mobile OEMs always-on context awareness
- PolarPro 3 announced, QuickLogic's first reprogrammable logic device for mobile and industrial markets
2012
- ArcticLink III BX display interface bridge announced, offering OEMs a low-cost, flexible solution for bridging displays with mobile processors
2011
- ArcticLink III VX announced, combining display bridging with visual enhancement and power savings technologies
- VEE HD+ and HD+ announced, extending the high-quality display experience and battery life savings for smartphones and tablets with up to FullHD 1,920 × 1,200 displays
2010
- ArcticLink II VX display bridge announced, introducing Visual Enhancement Engine and providing a high-quality display experience with 25% average battery life extension for smartphones
2008
- Announced PolarPro II FPGA, designed to meet the connectivity, intelligence, security and system logic requirements for mobile applications
2007
- CSSP Solutions customer engagement model announced; innovative hardware + software solution for mobile and industrial customers
2001
- Introduction of first SoC (MCU + eFPGA)
1999
- October 15 - Initial Public Offering on Nasdaq
1997
- Introduction of first standard product with eFPGA
1994
- Open Tool Synthesis introduced
1991
- Introduction of market's highest performance, lowest power FPGAs
1988
- Founded by three of the early inventors of the programmable logic industry, John Birkner, Andy Chan, HT Chua
- Introduction of ViaLink technology
