This week at CES, QuickLogic and Infineon will showcase the FLEXino Sensor Fusion Development Kit from global supply chain and manufacturing company Flex. This kit includes a sensor fusion daughter board which features QuickLogic’s EOS S3 SoC ultra-low power voice and sensor processing platform along with Infineon’s DPS310 digital barometric pressure sensor and IM69D130 digital MEMS microphone plus a 6-axis IMU and a 64Mb SPI flash. The FLEXino kit is highly flexible and is a great choice for developers who need to quickly develop and prototype any of a broad range of IoT devices. In addition, the kit features a small form factor integrating many of the most common sensors used in a variety of commercial, industrial, and consumer applications.

Furthermore, Flex has developed a complementary 12mm x 12mm System-in-Package (SiP) version of the development board which can be “dropped in” to a system to free the host processor from having to directly support always-on sensor fusion compute loads.

Our collaboration with Flex and Infineon is important for two reasons. First, IoT developers now have a complete, seamless, and world class prototyping-to-high volume manufacturing solution for a wide range of applications. Second, the collaboration itself shows that QuickLogic’s EOS S3 Voice and Sensor Processing Platform has become a critical element of the tech world’s IoT development ecosystem.

More information is available in the Flex press release making the announcement {click here}, and if you are planning on visiting CES please contact us to set up a visit to our suite or see the kit at the Infineon booth.